IC analysis example
EMC burnt external inspection & die melt de-capsulation analysis
Display Drive IC Analysis Case
Non-destructive X-ray analysis
Short or leakage failure curve trace & fault localization
ESD Protection Circuit De-layer Analysis Case
Metal 4 layer
Metal 3 layer
Metal 2 layer
Metal 1 layer
Gate layer
BGA IC Solder Analysis Case
BGA IC solder cross section analysis & size measurement
MLCC Analysis Case
MLCC cross section analysis (electrode melt)
Genuine product identification analysis case
[normal product]
[Suspicious product]
Counterfeit analysis: external marking design, blacktop, re-plating, lead frame design,
die design, die logo and manufacturer
die design, die logo and manufacturer
